Effect of Solder Penetration Ratio on Thermal Fatigue Life of SMP Connector Solder Joint

The solder joint quality of sub miniature push-on (SMP) connectors affects the function achievement of the component directly. In this paper the finite element models of a component with solder penetration ratios of 15% and 100% are respectively established. The stress, creep strain and creep strain energy density response characteristics of solder joints with two solder penetration ratios under thermal cycling loads are analyzed. The cycles of fracture initiation and thermal fatigue life of the solder joints are obtained based on the Darveaux model. Moreover, accelerated tests of thermal cycling are conducted. The fracture phenomenon of solder joints after 200 accelerated tests is in accordance with the calculated results, which verifies the effectiveness of the evaluation method for thermal fatigue life of the SMP connector solder joints.