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    WANG B, RAN G L, LIU M, et al. A study on influence of Cu3Sn phase thickness on shear performance of Cu-Sn IMC joint[J]. Electro-Mechanical Engineering, 2025, 41(5): 1−7. DOI: 10.19659/j.issn.1008–5300.20250614066
    Citation: WANG B, RAN G L, LIU M, et al. A study on influence of Cu3Sn phase thickness on shear performance of Cu-Sn IMC joint[J]. Electro-Mechanical Engineering, 2025, 41(5): 1−7. DOI: 10.19659/j.issn.1008–5300.20250614066

    A Study on Influence of Cu3Sn Phase Thickness on Shear Performance of Cu-Sn IMC Joint

    • The shear deformation and fracture behavior of Cu-Sn intermetallic compound (IMC) joints with different thicknesses of Cu3Sn phases without current (0 A/cm2) and with current (3×102 A/cm2) stressing are studied in this paper. The results show that: whether under current stressing or not, the equivalent modulus and shear strength of the joints increase with the increase of Cu3Sn phase thickness, and the maximum strength is 89.1 MPa (0 A/cm2) and 83.2 MPa (3×102 A/cm2) respectively; the equivalent modulus and shear strength of the joints decrease under current stressing, and the decrease rate decreases with the increase of Cu3Sn phase thickness, which indicates that Cu3Sn phase has better current resistance than Cu6Sn5 phase; with the increase of Cu3Sn phase thickness, the fracture (a brittle fracture) position of the joints gradually changes from Cu6Sn phase to the phase interface between Cu6Sn5 and Cu3Sn and finally in the Cu3Sn phase whether under current stressing or not. These research results provide necessary data support and theoretical support for the accurate evaluation of the reliability of Cu-Sn IMC joints.
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