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    CHENG Ming-sheng, CHEN Gai-qing, CHEN Qi-hai, JIANG Jian-qian. High Density Packaging of X-Band T/R Modules[J]. Electro-Mechanical Engineering, 2006, 22(4): 43-46.
    Citation: CHENG Ming-sheng, CHEN Gai-qing, CHEN Qi-hai, JIANG Jian-qian. High Density Packaging of X-Band T/R Modules[J]. Electro-Mechanical Engineering, 2006, 22(4): 43-46.
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    High Density Packaging of X-Band T/R Modules

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    • In this paper,we focus on high density assembly technology which is used in microwave TR modules.LTCC substrate,interconnection of MMICs and assembly technology of LLP device.The specifics of high density assembly technology are discussed in detail.
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