Analysis of Thermal Stress in Packaging of High Power Supply Module

PANG Qi-long; HUANG Chun-jiang

PANG Qi-long, HUANG Chun-jiang. Analysis of Thermal Stress in Packaging of High Power Supply Module[J]. Electro-Mechanical Engineering, 2010, 26(4): 10-13.

Citation:

PANG Qi-long, HUANG Chun-jiang. Analysis of Thermal Stress in Packaging of High Power Supply Module[J]. Electro-Mechanical Engineering, 2010, 26(4): 10-13.

Citation:

PANG Qi-long, HUANG Chun-jiang. Analysis of Thermal Stress in Packaging of High Power Supply Module[J]. Electro-Mechanical Engineering, 2010, 26(4): 10-13.

Analysis of Thermal Stress in Packaging of High Power Supply Module

Graphical Abstract

Graphical Abstract

Abstract

Abstract

Firstly,the temperature field in the packaging of high-power supply module with the thermal load is calculated by finite element method in this paper.The thermal stress distribution can be obtained from the calculated result of temperature field in the packaging.Then the fatigue failure induced by thermal stress cycle is found.The analysis and result of simulation are useful to optimize the packaging of high-power supply module and enhance the usable life of it.