Design and Optimization for Cold Plate of a Solid-state Transmitter Module

The solid-state transmitter module has large power,high and too concentrated heat consumption.The design of the cooling system for the solid-state transmitter module is both the key point and difficult point.The quality of the cooling system is directly related to the work of the solid-state transmitter module.The heat dissipation of a solid state transmitter module is discussed in this paper.The forced liquid cooling is chosen as its cooling mode by analyzing the heat consumption of the solid-state power amplifier tubes.At the same time,the flow rate of the cooling fluid needed is calculated.Then constant optimization for the design of the cold plate of the solid-state power amplifier tubes is carried out by simulation.Finally,the copper microchannel cold plate which meets project requirements is designed.Feasibility of the design scheme is verified by the test in the machine after the cold plate is installed.Comparative analysis of the differences of the cooling effects of all cold plates is also carried out in this paper.