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    GUO Shi-zheng, FU Jian-hui, GUO Xi-wen. Research and Applicaiton of New Type High Strength Low-temperature Cadmium Silver SolderJ. Electro-Mechanical Engineering, 2013, 29(3): 36-40.
    Citation: GUO Shi-zheng, FU Jian-hui, GUO Xi-wen. Research and Applicaiton of New Type High Strength Low-temperature Cadmium Silver SolderJ. Electro-Mechanical Engineering, 2013, 29(3): 36-40.

    Research and Applicaiton of New Type High Strength Low-temperature Cadmium Silver Solder

    • In the precise welding field of electronic equipment feeder system, it′s difficult to find a solder with high strength compatible with low welding temperature. In this paper a high strength solder which can be welded below 400 ℃ is analyzed in detail. After repeated tests and optimization, the matching solder is obtained with the weight ratio of 72% for Cd , 19% for Zn ,7% for Ag and 2% for Cu. Proper flux and special smelting technology are adopted to meet the requirements. Practice shows the solder is characterized by low welding temperature, high strength, good quality, good infiltration, good liquidity and good silver coating performance etc.
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