A Loop Heat Pipe System for Heat Dissipation of Computers with Closed Chassis and High Thermal Power

Electronic equipment working in the damp, dust, corrosion and other harsh environments needs to be sealed. An effective heat dissipation system is needed to ensure that the electronic equipment works safely and stably when the total thermal power is too high. A loop heat pipe system is designed in this paper. The evaporation section of this loop heat pipe is located inside the closed chassis. The working fluid in the evaporation section can transfer the heat steadily to the condensation section of the loop heat pipe which is located out-side the closed chassis. If the junction temperature of the electronic component on the PCB is below its upper limit, the loop heat pipe meets the design requirements. The theoretical calculation and numerical calculation indicate that the loop heat pipe system can ensure the computer with closed chassis and high thermal power to work safely and stably.