Design and Research of Spray Cooling Cold Plate

With increase of the power density of electronic chips, large radar and other equipment, the conventional heat dissipation methods are more and more difficult to achieve the desired thermal control requirements. Spray cooling has attracted widespread attention due to its advantages in high heat flux removal. In this paper, a cold plate with micro pressure swirl nozzles is designed based on spray cooling technology. The heat exchange performance and its influencing factors of the cold plate are researched through a set of self-designed spray cooling thermal performance test system . The maximum critical heat flux of this cold plate is above 100 W/cm². It provides an innovative design choice for future electronic equipment cooling and has good application prospects.