Study on Non-corrosive Induction Soldering Process of Microwave Sealing Device

The local nickel-plated copper is used for the aluminum alloy microwave device joint, and the polytetrafluorous copper sheet with copper layer on both sides is used to realize the solderability of microwave device joint and teflon material. The optimized leakage screen is used to add the solder paste, effectively control the preset amount of the solder paste and ensure the consistency of the soldering seam. The uniformity of the induction heating temperature field of the rectangular joint is solved by optimizing the induction heating coil. The stable process parameters are obtained through studying the technological process of the induction soldering of the microwave device. The advantages of rapidity and locality of the induction heating enable the soldering of the microwave sealed device to be realized quickly and locally.