Advanced Search
    LIU Bin, MOU Changjun, WANG Li, ZHENG Yanshuai. Thermal Design of a Certain Electronic Equipment[J]. Electro-Mechanical Engineering, 2020, 36(1): 34-37, 41.
    Citation: LIU Bin, MOU Changjun, WANG Li, ZHENG Yanshuai. Thermal Design of a Certain Electronic Equipment[J]. Electro-Mechanical Engineering, 2020, 36(1): 34-37, 41.

    Thermal Design of a Certain Electronic Equipment

    • Taking the research and development of a certain electronic equipment as an example, the thermal design of equipment is analyzed and calculated according to the actual work conditions and the engineering empirical formula. The cooling mode, fan specifications and radiator parameters of the equipment are determined. On this basis, the temperature field distribution of the equipment is simulated by thermal analysis software Icepak. Then the temperature test is carried out according to the environmental adaptability indexes. And the test results are compared with the simulation results. The simulation and experiment results show that the thermal design can satisfy the system environment adaptability indexes, and the theoretical calculation and thermal simulation analysis method are practical and effective,which has important reference value to the similar product design.
    • loading

    Catalog

      Turn off MathJax
      Article Contents

      /

      DownLoad:  Full-Size Img  PowerPoint
      Return
      Return