Technology of ENEPEG on AlN HTCC

AlN high temperature co-fired ceramic (HTCC) has good heat dissipation performance. Its thermal conductivity is about two orders of magnitude higher than LTCC. The coefficient of thermal expansion of HTCC matches with chips. In the HTCC production process, it is necessary to use tungsten paste with high melting point. However, tungsten itself has no solderability and bonding ability, so the surface modification must be carried out for the tungsten conductor at the surface of HTCC to make it has solderability and bonding ability, and thus facilitate the electronic assembly. ENEPEG is the most ideal solution for this surface modification. There are few literatures about HTCC electroless plating. The principle of ENEPEG deposition on HTCC and the reason of bad adhesion during ENEPEG deposition are discussed in this paper, so as to provide guidance for the quality control of ENEPEG on HTCC.