Research and Application of LRM Heat Conduction Structure in Rugged Computer

In order to effectively improve the thermal conductivity of heat conduction structure of the line replaceable module (LRM), combined with the thermal design of LRM in a rugged computer, the heat conduction structure of LRM which can effectively realize the heat dissipation requirement of heat source is developed and the effective measures to reduce the contact thermal resistance of LRM are given in this paper. The thermal simulation analysis of heat conduction structure of LRM is carried out by Icepak. The effect of different heat conduction materials and different heat conduction filling media on the heat dissipation performance of LRM is obtained and the optimal solution to the heat dissipation efficiency of heat conduction structure of LRM is analyzed. The heat dissipation performance of LRM in the rugged computer is tested actually. The result shows that the heat dissipation efficiency of heat conduction structure of LRM is better than that of other heat dissipation structures, which fully meets the heat dissipation requirements of heat source. The comparison results of thermal simulation and thermal test show that the calculation results of Icepak are close to the test results. The calculation results of Icepak have reference value at the thermal design stage of LRM.