Optimization Design and Experimental Verification of Liquid Cooling Power Amplifier Module

As the heat flux density of power amplifier chips is getting higher and higher, local high temperature has become the main reason for equipment performance degradation or even failure. Aiming at the power amplifier module with high heat consumption in an airborne platform, this paper firstly calculates the liquid cooling heat dissipation of the equipment and determines the flow rate required for liquid cooling. Then combined with the simulation calculation, the structure of the power amplifier module is optimized. By increasing the thickness of the local bottom plate, the thermal diffusion ability is improved. Combined with experimental tests, the thermal installation method of the module is optimized and thermal grease is selected as the interface material between the module and the cold plate. In the high temperature experiment, the chip case temperature of the optimized module is reduced by 13.7 ℃, which is lower than the maximum allowable case temperature and meets the thermal design requirements of the equipment.