Research on Nanosecond Pulse Laser Drilling Processing of Alumina Ceramic Substrate

As the core component of radar microwave module, alumina (Al₂O₃) ceramic is a hard and brittle material, which limits the through hole processing by traditional processing methods. Laser machining, a noncontact high-energy beam machining method, is the best choice for hole ablation on Al₂O₃ ceramic surface. The effects of laser processing parameters (including the average laser power, the scanning speed and the scanning times) on the characteristic sizes of holes (including inlet diameter, outlet diameter and taper) are studied and the relevant mechanisms are analyzed in this paper. This study provides significant theoretical and technical support for through hole drilling of electronic ceramic substrates for radar microwave.