Application Research on Heat Pipe Module in Airborne ATR Closed Cabinet

In the ATR closed cabinet, multiple central processing units (CPU) heat sources are integrated. The thermal power consumption of a single CPU heat source reaches 80 W. In order to solve the heat dissipation problem of the whole device in high temperature environment, a heat dissipation structure of the cabinet based on heat pipe module is proposed. Through structural design of the heat pipe module, on the basis of making the cabinet closed, the heat of each heat source is quickly transmitted to the air ducts on both sides of the cabinet, thus the heat conduction efficiency between the heat source and the external heat sink is improved. The heat conduction structure of the heat pipe module, the parameter setting of the fin radiator of the heat pipe module and the type selection of the fan are theoretically analyzed and calculated. It is concluded that the heat pipe module has the characteristics of high heat conduction efficiency and low thermal resistance. The heat dissipation performance of the heat pipe module is simulated by ANSYS Icepak thermal simulation software. The simulation result is compared with the temperature test results of CPU in the high temperature test environment. The comparison results show that the thermal simulation can truly reflect the thermal design effect in the design stage, and the heat dissipation performance of the heat pipe module meets the heat dissipation requirements of the cabinet and the heat dissipation problem of multi-heat source inside the cabinet is solved. The effective method of solving the heat dissipation problem of multi-heat source in ATR closed cabinet can be used as a reference for the thermal design of similar cabinets.