Thermal Design and Simulation of High Performance Computer for Spacecraft Equipment

With development of the spacecraft embedded computers towards high performance, high integration and miniaturization, the heat flow density in system increases sharply and conventional thermal design can no longer meet the urgent needs of efficient cooling. According to the thermal design requirement of satellite data processor, a full-path efficient heat conduction method depending on graphite heat film is proposed in this paper. Simulation analysis and test are carried out and both results show that the thermal design can meet the requirement. To further verify the cooling improvement of graphite heat film, the graphite heat film and conventional metal heat conduction are compared through simulation. The results show that attaching graphite heat film on calculation frame can reduce the temperature of digital signal processor (DSP) chip about 4 ℃ lower than adopting conventional metal. This conclusion can be used as reference for thermal design of the high performance computer on satellites.