Application of Engineering Plastic in Weight Reduction of Electronic Equipment

The main purpose of this paper is to reduce the weight of electronic equipment by adopting engineering plastics. Firstly, the main functions of the electronic chassis structure are analyzed and the feasibility of replacing metal materials with engineering plastics is discussed. The application of engineering plastic can be realized by replacing load-bearing parts instead of heat conducting parts. Then aiming at the problem that engineering plastic is generally non-conductive, metal coating is used to improve its conductivity. Several kinds of conductive coating are selected to test their conductivity and tri-proof property. Finally, some structural parts are replaced by plastic (PC) and nylon (PA) materials using 3D printing technology combined with machining. Thus the weight reduction design of an electronic chassis is realized. And the mechanical and electromagnetic compatibility experiments for the prototype are carried out to verify this method.