Thermal Design Optimization of Top Cover of 5G Base Station

In this paper, the thermal design optimization is carried out for the riveted top cover of the active antenna unit (AAU) in order to improve its cooling efficiency. By bending the top of the phase change inhibited (PCI) fins to L-shape and interlocking the top bent parts with each other, an integrated top cover with L-shaped fins can be built, which replaces the original top cover. This study compares the performance gains of the L-fins top cover with that of the riveted top cover through thermal analysis of heat dissipation, simulation analysis and experimental verification. The research conclusions are as follows: there is no thermal contact resistance between the L-fins top cover and the PCI fins, hence the average temperature of top cover increases and the cooling performance of top cover improves significantly; the temperatures of key chips decrease by 0.4 ℃ to 1.0 ℃, the simulation and experimental results are consistent; the fin height can be reduced equivalently by 8 mm and the overall weight can be reduced by 0.45 kg; the recommended hole width is (3 ± 0.5) mm and the recommended open ratio is 25% to 30%.