Thermal Design and Parameter Optimization of a Vehicle-borne Millimeter-wave Radar Module

For efficient and reliable heat dissipation of millimeter-wave radar modules, according to the thermal control requirements of radar module, the integrated thermal control structure design of the uniform temperature plate and air-cooled heat sink is proposed. The thermal design software is employed to analyze and optimize the thermal design structure of the radar module. The research results show that the temperatures of the module chips are below the safe temperature and the maximum junction temperature of the emitter chip (the maximum temperature) is 141.1 ℃. Compared with the traditional air-cooled heat sink, the novel integrated air-cooled heat sink can reduce the maximum temperature of the chip by 9.8 ℃. In addition, the structural parameters and interface contact thermal resistance of the air-cooled heat sink are analyzed. It is determined that the optimal thermal design scheme is 30 mm fin height of uniform temperature plate and 3 mm fin spacing. This research results provide a reference for engineering application of high efficiency air-cooled heat dissipation and millimeter-wave module thermal design.