Research on Packaging Structure of T/R Components Based on Multi-field Coupling Simulation

Aiming at the packaging needs of large scale T/R module, a packaging form based on aluminum alloy material system is proposed. 6063 aluminum is selected as the shell, 4A11 material is used as the cover plate and the FR4 substrate is matched for packaging. Based on the boundary conditions of thermal-structural multi-field coupling, the welding process is simulated by the finite element algorithm and the impact of welding process on the shell deformation is effectively evaluated. At the same time, the innovative structure of Kovar-Cu heterogeneous connector is designed to solve the welding failure problem of the shell and the traditional hermetic connector. There is no air leakage or structural failure after 200 temperature shock tests, which verifies the reliability of the material system and the packaging structure.